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Precision Roller Plating Equipment
Precision Roller Plating Equipment is primarily used in the electronic plating sector, where products are small, prone to deformation, and susceptible to material jamming. As such, the roller barrel structure is more refined, and the equipment’s transmission system is designed for greater reliability. Additionally, it is essential to maintain continuous electrical conductivity to ensure the quality of the roller plating process.。
Electronic Electroplating Equipment
The Electronic Electroplating Equipment features a unique oscillating structure design that enhances the impact between the auxiliary materials and the interior of deep blind holes, effectively cleaning the holes and creating favorable conditions for subsequent electroplating processes. Additionally, the design of theworkpiece carrier prevents the bending of parts, thereby improving the electroplating yield rate.
Packaging Shell Electroplating Equipment
Packaging Shell Electroplating Equipment is a modern tool specifically designed for metal surface treatment, providing electronic components with a robust and reliable protective coating. The complexity of electroplating the cavities, along with the high demands for uniform film thickness, requires precise control. The post-plating process ensures the product is thoroughly clean, with no watermarks remaining.
The Semiconductor Equipment
The Semiconductor Equipment Cleaning and Repair Machine is designed to address issues such as crystallization, wear, and corrosion that occur during the operation of semiconductor equipment. These issues require cleaning or repair to restore the equipment for reuse. This specialized cleaning and repair machine is widely used in the semiconductor equipment recycling industry.
The PCB Chemical Plating Equipment
The PCB Chemical Plating Equipment is primarily used in processes such as chemical copper, chemical tin, chemical palladium, and chemical nickel-gold. It employs a basket-loading method for workpieces and incorporates special piping designs and oscillating structures to enhance its deep plating capabilities or to achieve through-hole metallization.
The Circuit Board Electroplating Equipment
The Circuit Board Electroplating Equipment is commonly used for processes such as copper plating on the board surface, pattern plating, or nickel-gold plating. It employs different clamping methods for hard boards, thin boards, and flexible boards to ensure effective conductivity and enhance the uniformity of the electroplating process.
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广东思铂智能装备科技有限公司
广东顺德思铂环保科技有限公司
江门市思铂自动化科技有限公司
ES-PRO TECHNOLOGY Co.,LTD
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