The Carrier Plate Hole Filling Electroplating Equipment

The Carrier Plate Hole Filling Electroplating Equipment is designed for carrier plate, which serve as the critical link between chips and circuit boards, facilitating signal transmission, chip protection, and heat dissipation. Given the stringent requirements for hole filling electroplating, our equipment utilizes ultrasonic-assisted technology to enhance deep plating capability and achieve superior coating density, ensuring optimal performance and reliability.

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The Carrier Plate Hole Filling Electroplating Equipment

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广东思铂智能装备科技有限公司
广东顺德思铂环保科技有限公司
江门市思铂自动化科技有限公司
ES-PRO TECHNOLOGY Co.,LTD

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TEL：0750-8620888
FAX：0750-8620889
Domestic Official Website：
www.espro.com.cn
International Official Website：
www.espro.com.sg

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